JPS6311737Y2 - - Google Patents

Info

Publication number
JPS6311737Y2
JPS6311737Y2 JP1982188119U JP18811982U JPS6311737Y2 JP S6311737 Y2 JPS6311737 Y2 JP S6311737Y2 JP 1982188119 U JP1982188119 U JP 1982188119U JP 18811982 U JP18811982 U JP 18811982U JP S6311737 Y2 JPS6311737 Y2 JP S6311737Y2
Authority
JP
Japan
Prior art keywords
copper
heat dissipation
package body
tungsten
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982188119U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5991742U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982188119U priority Critical patent/JPS5991742U/ja
Publication of JPS5991742U publication Critical patent/JPS5991742U/ja
Application granted granted Critical
Publication of JPS6311737Y2 publication Critical patent/JPS6311737Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1982188119U 1982-12-13 1982-12-13 半導体用パツケ−ジ Granted JPS5991742U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982188119U JPS5991742U (ja) 1982-12-13 1982-12-13 半導体用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982188119U JPS5991742U (ja) 1982-12-13 1982-12-13 半導体用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5991742U JPS5991742U (ja) 1984-06-21
JPS6311737Y2 true JPS6311737Y2 (en]) 1988-04-05

Family

ID=30405905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982188119U Granted JPS5991742U (ja) 1982-12-13 1982-12-13 半導体用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5991742U (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107063A (en) * 1980-12-25 1982-07-03 Nec Corp Semiconductor package
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板

Also Published As

Publication number Publication date
JPS5991742U (ja) 1984-06-21

Similar Documents

Publication Publication Date Title
US5644163A (en) Semiconductor device
US4670771A (en) Rectifier module
US7635916B2 (en) Integrated circuit package with top-side conduction cooling
JP2592308B2 (ja) 半導体パッケージ及びそれを用いたコンピュータ
JPH01253942A (ja) 半導体パッケージ及びそれを用いたコンピュータ
JPH02138761A (ja) 半導体装置
US5200640A (en) Hermetic package having covers and a base providing for direct electrical connection
JPS62249429A (ja) 半導体装置
JPS6311737Y2 (en])
JP7551571B2 (ja) 半導体モジュール
JPS59134852A (ja) 集積回路パツケ−ジ
JP2501279B2 (ja) 半導体パッケ―ジ
JPH05315467A (ja) 混成集積回路装置
JPS62291158A (ja) Ｉｃパツケ−ジ
JPH0897336A (ja) 半導体装置
JPH0547953A (ja) 半導体装置用パツケージ
CN221447148U (zh) 半导体封装结构
JPS6220701B2 (en])
JP3335657B2 (ja) 半導体パッケージ
US10410959B2 (en) Lead package and method for minimizing deflection in microelectronic packaging
JPS63169749A (ja) 半導体装置
JPH01151252A (ja) セラミックパッケージとその製造方法
JPS5931046A (ja) 半導体装置
JPH0377355A (ja) 放熱型半導体装置
JPH0333074Y2 (en])